SØG - mellem flere end 8 millioner bøger:
Viser: 3D Stacked Chips - From Emerging Processes to Heterogeneous Systems
Søgbar e-bog
3D Stacked Chips Vital Source e-bog
Ibrahim (Abe) M. Elfadel
(2016)
Springer Nature
897,00 kr.
Leveres umiddelbart efter køb
3D Stacked Chips Vital Source e-bog
Ibrahim (Abe) M. Elfadel
(2016)
Springer Nature
724,00 kr.
Leveres umiddelbart efter køb
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Ibrahim (Abe) M. Elfadel og Gerhard Fettweis
(2016)
Sprog: Engelsk
Springer International Publishing AG
581,00 kr.
Print on demand. Leveringstid vil være ca 2-3 uger.
Detaljer om varen
- Vital Source searchable e-book (Fixed pages)
- Udgiver: Springer Nature (Maj 2016)
- ISBN: 9783319204819
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Licens varighed:
Bookshelf online: 5 år fra købsdato.
Bookshelf appen: ubegrænset dage fra købsdato.
Udgiveren oplyser at følgende begrænsninger er gældende for dette produkt:
Print: 2 sider kan printes ad gangen
Copy: højest 2 sider i alt kan kopieres (copy/paste)
Bookshelf online: 5 år fra købsdato.
Bookshelf appen: ubegrænset dage fra købsdato.
Udgiveren oplyser at følgende begrænsninger er gældende for dette produkt:
Print: 2 sider kan printes ad gangen
Copy: højest 2 sider i alt kan kopieres (copy/paste)
Detaljer om varen
- Vital Source 365 day rentals (fixed pages)
- Udgiver: Springer Nature (Maj 2016)
- ISBN: 9783319204819R365
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Licens varighed:
Bookshelf online: 5 år fra købsdato.
Bookshelf appen: 5 år fra købsdato.
Udgiveren oplyser at følgende begrænsninger er gældende for dette produkt:
Print: 2 sider kan printes ad gangen
Copy: højest 2 sider i alt kan kopieres (copy/paste)
Bookshelf online: 5 år fra købsdato.
Bookshelf appen: 5 år fra købsdato.
Udgiveren oplyser at følgende begrænsninger er gældende for dette produkt:
Print: 2 sider kan printes ad gangen
Copy: højest 2 sider i alt kan kopieres (copy/paste)
Detaljer om varen
- Hardback: 300 sider
- Udgiver: Springer International Publishing AG (Maj 2016)
- Forfattere: Ibrahim (Abe) M. Elfadel og Gerhard Fettweis
- ISBN: 9783319204802
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Introduction to Electrical 3D Integration.- Copper-based TSV - Interposer.- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization.- Energy Efficient Electrical Intra-Chip Stack Communication.- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks.- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver.- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications.- Accurate Temperature Measurement for 3D Thermal Management.- EDA Environments for 3D Chip Stacks.- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias.- Introduction to Optical Inter- and Intraconnects.- Optical Through-Silicon Vias.- Integrated Optical Devices for 3D Photonic Transceivers.- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators.- Athermal photonic circuits for optical on-chip interconnects.- Integrated Circuits for 3D Photonic Transceivers.- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-
De oplyste priser er inkl. moms
Butikker og åbningstid
Handler du som firma
Forretningsbetingelser
Porto og forsendelse
Data & cookiepolitik
Handler du som firma
Forretningsbetingelser
Porto og forsendelse
Data & cookiepolitik
Polyteknisk Boghandel og Forlag A/S - Anker Engelundsvej 1 - 2800 Lyngby
Tlf 77 42 43 44 - email poly@polyteknisk.dk - CVR 34072655 - Sydbank Reg: 6748 Konto 0001107927
Tlf 77 42 43 44 - email poly@polyteknisk.dk - CVR 34072655 - Sydbank Reg: 6748 Konto 0001107927